Taputapu Whakaangawari Wafer mō te Tukatuka Wafer Sapphire/SiC/Si 4 Inihi ki te 12 Inihi

1. Tākai Matatau
• Ngā IC 3D: Mā te whakangawari i te angaanga ka taea te whakarārangi poutū o ngā maramara arorau/mahara (hei tauira, ngā whakarārangi HBM), ka eke ki te 10× teitei ake te whānui me te 50% te whakaiti i te whakamahinga hiko​ki te whakatauritea ki ngā otinga 2.5D. Ka tautokohia e te taputapu te hononga ranu me te whakaurunga TSV (Through-Silicon Via), he mea nui mō ngā tukatuka AI/ML e hiahia ana ki te <10 μm te hononga hononga. Hei tauira, mā ngā angaanga 12-inihi kua whakangawaritia ki te 25 μm ka taea te whakarārangi i ngā paparanga 8+ me te pupuri tonu i te <1.5% te angaanga, he mea nui mō ngā pūnaha LiDAR motuka.

• Tākai Pā-Whai-ā-ringa: Mā te whakaiti i te matotoru o te papapātuhi ki te 30 μm, ka whakapotohia te roa o te hononga mā te 50%, ka whakaitihia te whakaroa tohu (<0.2 ps/mm) ā, ka taea ai ngā maramara tino-kikokore 0.4 mm mō ngā SoC pūkoro. Ka whakamahia e te tukanga ngā rauropi huri kua whakatikatikaina e te ahotea hei ārai i te piko (mana TTV >50 μm), ka whakarite i te pono i roto i ngā tono RF auau-teitei.

2. Ngā Hikohiko Mana
• Ngā Wāhanga IGBT: Mā te angiangi ki te 50 μm ka whakaitihia te ātete wera ki te <0.5°C/W, ka taea ai e ngā MOSFET SiC 1200V te mahi i ngā pāmahana hononga 200°C. Ka whakamahia e ā mātou taputapu te huri maha-wāhanga (mātotoru: kirikiri 46 μm → kirikiri pai: kirikiri 4 μm) hei whakakore i te kino o raro i te mata, ka tutuki ai te >10,000 huringa o te pono o te huringa wera. He mea nui tēnei mō ngā kaitahuri EV, ina whakapai ake ngā papa SiC 10 μm-matotoru i te tere whakawhiti mā te 30%.
• Ngā Pūrere Hiko GaN-on-SiC: Mā te whakangawari i te angaanga ki te 80 μm ka whakarei ake i te nekenekehanga irahiko (μ > 2000 cm²/V·s) mō ngā 650V GaN HEMT, ka whakaitihia ngā ngaronga ara iahiko mā te 18%. Ka whakamahia e te tukanga te tapahi ā-reera hei ārai i te pakaru i te wā e whakangawari ana, ka tutuki ai te pakaru taha <5 μm mō ngā whakakaha hiko RF.

3. Ngā taputapu hiko
• Ngā rama LED GaN-on-SiC: Ka whakapai ake ngā papa sapphire 50 μm i te pai o te tango māramatanga (LEE) ki te 85% (ki te 65% mō ngā wafer 150 μm) mā te whakaiti i te hopu photon. Mā te mana whakahaere TTV tino iti o ā mātou taputapu (<0.3 μm) ka whakarite kia ōrite te tukunga rama LED puta noa i ngā wafer 12-inihi, he mea nui mō ngā whakaaturanga Micro-LED e hiahia ana kia ōrite te roanga ngaru <100nm.
• Silicon Photonics: Mā ngā papa silicon matotoru 25μm ka taea te whakaiti i te ngaronga horapa o te 3 dB/cm i roto i ngā arataki ngaru, he mea nui mō ngā transceiver whatu 1.6 Tbps. Ka whakauruhia e te tukanga te whakangawari CMP hei whakaiti i te taratara o te mata ki te Ra <0.1 nm, ka whakarei ake i te pai o te hononga mā te 40%.

4. Ngā Pūoko MEMS
• Ngā ine whakatere: Ka tutuki i ngā papa silicon 25 μm te SNR >85 dB (ki te 75 dB mō ngā papa 50 μm) mā te whakanui ake i te aro o te nekehanga papatipu-whakamātautau. Ka whakatikatikahia e tā mātou pūnaha huri tuaka-rua ngā pikinga ahotea, ka whakarite kia <0.5% te nekenga aro o te neke atu i te -40°C ki te 125°C. Kei roto i ngā tono ko te kimi tukinga motuka me te aroturuki nekehanga AR/VR.

• Ngā Pūoko Pēhanga: Mā te angiangi ki te 40 μm ka taea te ine i te 0–300 pae me te hysteresis FS <0.1%. Mā te whakamahi i te hononga rangitahi (ngā kaikawe karāhe), ka karohia e te tukanga te pakaru o te anga i te wā e whakairohia ana te taha o muri, ka tutuki ai te manawanui pēhanga nui <1 μm mō ngā pūoko IoT ahumahi.

• Te Mahi Tahi Hangarau: Ka whakakotahi ā mātou taputapu angiangi wafer i te huri ā-ringa, te CMP, me te whakairo plasma hei whakatika i ngā momo wero rauemi (Si, SiC, Sapphire). Hei tauira, me huri te GaN-on-SiC i ngā momo huri ranu (ngā wira taimana + plasma) hei whakataurite i te pakeketanga me te whānui wera, ko ngā pūoko MEMS ia e hiahia ana ki te taratara o te mata i raro i te 5 nm mā te whakakanapa CMP.

• Pānga Ahumahi: Mā te whakahohe i ngā angiangi, ngā angiangi ake, he pai ake te mahi, ka akiakihia e tēnei hangarau ngā auahatanga i roto i ngā maramara AI, ngā kōwae 5G mmWave, me ngā hikohiko ngāwari, me ngā manawanui TTV <0.1 μm mō ngā whakaaturanga takai me te <0.5 μm mō ngā pūoko LiDAR motuka.