Hua
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4H-N 8 inihi SiC tïpako angiangi Silicon Carbide Dummy Rangahau māka 500um matotoru
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4H-N/6H-N SiC Wafer Reasearch production Dummy grade Dia150mm Silicon carbide tïpako
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12 inihi SIC tïpako silicon carbide kōeke matua diameter 300mm rahi nui 4H-N He pai mo te taputapu hiko teitei tohanga wera
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Dia300x1.0mmt Matotoru Sapphire Wafer C-Mahere SSP/DSP
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HPSI SiC wafer dia:3inihi te matotoru:350um± 25 µm mo te Hiko Hiko
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8 inihi SiC silicon carbide angiangi 4H-N momo 0.5mm production kōeke rangahau kōeke ritenga oro tïpako
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8 inihi 200mm Sapphire tïpako angiangi sapphire angiangi matotoru 1SP 2SP 0.5mm 0.75mm
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Kiriata kotahi Al2O3 99.999% Dia200mm sapphire angiangi 1.0mm 0.75mm te matotoru
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156mm 159mm 6 inihi Sapphire Wafer mo te kaikawe C-Plane DSP TTV
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C/A/M tuaka 4 inihi angiangi sapphire karaihe kotahi Al2O3,SSP DSP tïpako hapaira pakeke teitei
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3inihi Tino parakore Semi-Insulating （HPSI）SiC wafer 350um Dummy grade Koeke Pirimia
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P-momo SiC tïpako SiC angiangi Dia2inihi hua hou