I tenei wa, ka taea e to taatau kamupene te tuku i nga waahanga iti o te 8inchN momo SiC wafers, mena kei a koe nga hiahia tauira, tena koa waea mai ki a au. Kei a matou etahi tauira angiangi kua reri ki te tuku.
I roto i te mara o nga rauemi semiconductor, kua tino angitu te kamupene ki te rangahau me te whakawhanaketanga o nga tioata SiC rahi. Ma te whakamahi i ona ake tioata uri i muri i nga rauna maha o te whakanui i te diameter, kua pai te tipu o te kamupene 8-inihi momo N-momo kiripiri SiC, e whakaoti rapanga uaua penei i te waahi pāmahana pahekeheke, te pakaru o te karaihe me te wahanga hau te tohatoha rauemi mata i roto i te tipu o te tipu. Ko nga tioata SIC 8-inihi, me te whakatere i te tipu o nga kiripiri SIC rahi nui me te hangarau tukatuka motuhake me te whakahaere. Ka tino whakanui i te whakataetae matua o te kamupene i roto i te SiC kotahi ahumahi tïpako karaihe. I te wa ano, te kamupene kaha whakatairanga i te haaputuputuraa o te hangarau me te tukanga o te rahi nui silicon carbide tïpako faaineineraa raina whakamātautau, whakapakari i te whakawhitinga hangarau me te mahi tahi ahumahi i roto i te awa whakarunga, me te whakararo mara, me te mahi tahi ki te kiritaki ki te huri tonu mahi hua, me te tahi. ka whakatairanga i te tere o te tono ahumahi o nga rauemi carbide silicon.
| 8inihi N-momo SiC DSP Specs | |||||
| Tau | Tūemi | Waeine | Whakaputa | Rangahau | Porekau |
| 1. Tawhā | |||||
| 1.1 | polytype | -- | 4H | 4H | 4H |
| 1.2 | takotoranga mata | ° | <11-20>4±0.5 | <11-20>4±0.5 | <11-20>4±0.5 |
| 2. Tawhā hiko | |||||
| 2.1 | haupapa | -- | n-momo Nitrogen | n-momo Nitrogen | n-momo Nitrogen |
| 2.2 | parenga | ohm ·cm | 0.015~0.025 | 0.01~0.03 | NA |
| 3. Tawhā miihini | |||||
| 3.1 | diameter | mm | 200±0.2 | 200±0.2 | 200±0.2 |
| 3.2 | matotoru | μm | 500±25 | 500±25 | 500±25 |
| 3.3 | Takotoranga kakari | ° | [1- 100]±5 | [1- 100]±5 | [1- 100]±5 |
| 3.4 | Hōhonu Kāniwha | mm | 1~1.5 | 1~1.5 | 1~1.5 |
| 3.5 | LTV | μm | ≤5(10mm*10mm) | ≤5(10mm*10mm) | ≤10(10mm*10mm) |
| 3.6 | TTV | μm | ≤10 | ≤10 | ≤15 |
| 3.7 | Kopere | μm | -25~25 | -45~45 | -65~65 |
| 3.8 | Warp | μm | ≤30 | ≤50 | ≤70 |
| 3.9 | AFM | nm | Ra≤0.2 | Ra≤0.2 | Ra≤0.2 |
| 4. Hanganga | |||||
| 4.1 | kiato moroiti | ea/cm2 | ≤2 | ≤10 | ≤50 |
| 4.2 | ihirangi whakarewa | ngota/cm2 | ≤1E11 | ≤1E11 | NA |
| 4.3 | TSD | ea/cm2 | ≤500 | ≤1000 | NA |
| 4.4 | BPD | ea/cm2 | ≤2000 | ≤5000 | NA |
| 4.5 | TED | ea/cm2 | ≤7000 | ≤10000 | NA |
| 5. Te kounga pai | |||||
| 5.1 | mua | -- | Si | Si | Si |
| 5.2 | mutu mata | -- | Si-kanohi CMP | Si-kanohi CMP | Si-kanohi CMP |
| 5.3 | matūriki | ea/wafer | ≤100(rahi≥0.3μm) | NA | NA |
| 5.4 | rakuraku | ea/wafer | ≤5, Tapeke Length≤200mm | NA | NA |
| 5.5 | Tapa maramara / nuku / kapiti / poke / poke | -- | Karekau | Karekau | NA |
| 5.6 | Nga waahi polytype | -- | Karekau | Horahanga ≤10% | Horahanga ≤30% |
| 5.7 | tohu o mua | -- | Karekau | Karekau | Karekau |
| 6. Te kounga o muri | |||||
| 6.1 | mutu muri | -- | C-kanohi MP | C-kanohi MP | C-kanohi MP |
| 6.2 | rakuraku | mm | NA | NA | NA |
| 6.3 | Te taha taha o muri maramara / nuku | -- | Karekau | Karekau | NA |
| 6.4 | Te taratara o muri | nm | Ra≤5 | Ra≤5 | Ra≤5 |
| 6.5 | Te tohu o muri | -- | Kaniwha | Kaniwha | Kaniwha |
| 7. Tapa | |||||
| 7.1 | taha | -- | Chamfer | Chamfer | Chamfer |
| 8. Mōkī | |||||
| 8.1 | tākainga | -- | Epi-reri me te korehau tākainga | Epi-reri me te korehau tākainga | Epi-reri me te korehau tākainga |
| 8.2 | tākainga | -- | Maha-wafer tākai rīpene | Maha-wafer tākai rīpene | Maha-wafer tākai rīpene |
Te wa tuku: Apr-18-2023