Momo-N SiC i runga i ngā Papa Whakakotahi Si Dia6inihi
| 等级Tau | U 级 | P级 | D级 |
| Te Tohu BPD Iti | Taumata Whakaputa | Tauira Tauira | |
| 直径Diameter | 150.0 mm±0.25mm | ||
| 厚度Matotoru | 500 μm±25μm | ||
| 晶片方向Te Aronga o te Wafer | Tuaka ke: 4.0°ki te < 11-20 > ±0.5°mō te 4H-N Kei runga i te tuaka: <0001>±0.5°mō te 4H-SI | ||
| 主定位边方向Papa Matua | {10-10}±5.0° | ||
| 主定位边长度Roa Papatahi Tuatahi | 47.5 mm±2.5 mm | ||
| 边缘Te aukati taha | 3 mm | ||
| 总厚度变化/弯曲度/翘曲度 TTV/Bow /Warp | ≤15μm /≤40μm /≤60μm | ||
| 微管密度和基面位错MPD&BPD | MPD≤1 cm-2 | MPD≤5 cm-2 | MPD≤15 cm-2 |
| BPD≤1000cm-2 | |||
| 电阻率Ātete | ≥1E5 Ω·cm | ||
| 表面粗糙度Te taratara | Pōrana Ra≤1 nm | ||
| CMP Ra≤0.5 nm | |||
| 裂纹(强光灯观测) # | Kāore | Te roa tāpiri ≤10mm, te roa kotahi ≤2mm | |
| Ngā pakaru i te mārama kaha | |||
| 六方空洞(强光灯观测)* | Te horahanga tāpiri ≤1% | Te horahanga tāpiri ≤5% | |
| Pereti Hex mā te mārama kaha teitei | |||
| 多型(强光灯观测)* | Kāore | Te horahanga tāpiri ≤5% | |
| Ngā Rohe Polytype mā te mārama kaha teitei | |||
| 划痕(强光灯观测)*& | 3 ngā karawarawa ki te 1×te whānui o te angaanga | 5 ngā karawarawa ki te 1×te whānui o te angaanga | |
| Ngā karawarawa i te mārama kaha | roanga whakaemi | roanga whakaemi | |
| 崩边# Maramara taha | Kāore | 5 e whakaaetia ana, ≤1 mm ia | |
| 表面污染物(强光灯观测) | Kāore | ||
| Te poke i te mārama kaha | |||
Kauwhata Taipitopito

