Ngā Wafer SiC 4 inihi 6H Ngā Papa SiC Āhua-Whakamaroke, te kounga tuatahi, te rangahau, me te tauira rūpahu
Whakatakotoranga Hua
| Tau | Kore Tohu Whakaputa MPD (Tohu Z) | Paerewa Whakaputa Paerewa (P Grade) | Taumata Rūpahu (Taumata D) | ||||||||
| Diameter | 99.5 mm~100.0 mm | ||||||||||
| 4H-SI | 500 μm±20 μm | 500 μm±25 μm | |||||||||
| Te Aronga o te Wafer |
Tuaka ki waho: 4.0° ki te taha < 1120 > ±0.5° mō te 4H-N, Kei runga i te tuaka: <0001>±0.5° mō te 4H-SI | ||||||||||
| 4H-SI | ≤1cm-2 | ≤5 henimita-2 | ≤15 henimita-2 | ||||||||
| 4H-SI | ≥1E9 Ω·cm | ≥1E5 Ω·cm | |||||||||
| Te whakatakotoranga papatahi tuatahi | {10-10} ±5.0° | ||||||||||
| Roa Papatahi Tuatahi | 32.5 mm±2.0 mm | ||||||||||
| Roa Papatahi Tuarua | 18.0 mm±2.0 mm | ||||||||||
| Te whakatakotoranga papatahi tuarua | Ko te mata o te silicon ki runga: 90° CW. mai i te papatahi Matua ±5.0° | ||||||||||
| Te Whakakore i te Tapa | 3 mm | ||||||||||
| LTV/TTV/Pīkau/Whā | ≤3 μm/≤5 μm/≤15 μm/≤30 μm | ≤10 μm/≤15 μm/≤25 μm/≤40 μm | |||||||||
| Te taratara | Mata C | Pōrana | Ra≤1 nm | ||||||||
| Mata Si | CMP | Ra≤0.2 nm | Ra≤0.5 nm | ||||||||
| Ngā Kapiti o te Tapa i te Mārama Kaha Rawa | Kāore | Te roa tāpiri ≤ 10 mm, takitahi roa≤2 mm | |||||||||
| Pereti Hex mā te Mārama Kaha Teitei | Te horahanga tāpiri ≤0.05% | Te horahanga tāpiri ≤0.1% | |||||||||
| Ngā Rohe Momo-maha Mā te Mārama Kaha Teitei | Kāore | Te horahanga tāpiri ≤3% | |||||||||
| Ngā Whakaurunga Waro Tirohanga | Te horahanga tāpiri ≤0.05% | Te horahanga tāpiri ≤3% | |||||||||
| Ngā Karawarawa Mata Silicon e te Mārama Kaha Teitei | Kāore | Te roa tāpiri ≤1*te whānui o te angaanga | |||||||||
| Ngā Maramara Tapa Teitei Mā te Mārama Kaha | Kāore i whakaaetia te whānui me te hohonu ≥0.2 mm | 5 e whakaaetia ana, ≤1 mm ia | |||||||||
| Te Parahanga o te Mata Silicon mā te Kaha Nui | Kāore | ||||||||||
| Tākai | Rīpene Wafer Maha-wafer, Ipu Wafer Takitahi rānei | ||||||||||
Kauwhata Taipitopito
Ngā Hua e Pā Ana
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